Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPB60R099C6
MA000974308
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
15.501
0.304
0.091
304.026
2.681
10.133
111.466
553.954
9.657
0.228
0.001
0.230
0.184
8.772
0.165
0.548
547.666
Average
Mass
[%]
0.99
0.02
0.01
19.42
0.17
0.65
7.12
35.38
0.62
0.01
0.00
0.01
0.01
0.56
0.01
0.04
34.98
29. August 2013
1565.61 mg
Sum
[%]
0.99
Average
Mass
[ppm]
9901
194
58
19.45
0.17
194191
1712
6472
71197
43.15
0.62
353828
6168
146
0.01
0
147
117
0.58
5603
105
350
35.03
349811
350266
1000000
5867
146
431497
6168
194443
1712
Sum
[ppm]
9901
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com