Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP086N10N3 G
MA000973716
PG-TO220-3-123
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
4.609
1.407
0.422
1404.801
6.213
2.335
67.706
513.629
21.462
1.764
0.266
0.665
1.728
Average
Mass
[%]
0.23
0.07
0.02
69.29
0.31
0.12
3.34
25.34
1.06
0.09
0.01
0.03
0.09
29. August 2013
2027.01 mg
Sum
[%]
0.23
Average
Mass
[ppm]
2274
694
208
69.38
0.31
693043
3065
1152
33402
28.80
1.06
0.09
253393
10588
870
131
328
0.13
852
1311
1000000
287947
10588
870
693945
3065
Sum
[ppm]
2274
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com