Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPA126N10N3 G
MA000803290
PG-TO220-3-111
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
3.094
0.687
0.206
686.221
6.415
2.200
206.844
891.191
7.942
0.305
0.001
0.206
0.515
1.338
0.130
0.433
432.110
Average
Mass
[%]
0.14
0.03
0.01
30.64
0.29
0.10
9.23
39.79
0.35
0.01
0.00
0.01
0.02
0.06
0.01
0.02
19.29
29. August 2013
2239.84 mg
Sum
[%]
0.14
Average
Mass
[ppm]
1381
307
92
30.68
0.29
306372
2864
982
92348
49.12
0.35
397880
3546
136
0.01
1
92
230
0.09
597
58
193
19.32
192921
193172
1000000
919
136
491211
3546
306771
2864
Sum
[ppm]
1381
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com