Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
IDH10SG60C
MA000629888
PG-TO220-2-1
Material Group
noble metal
non noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
inorganic material
non noble metal
non noble metal
< 10%
Substances
gold
arsenic
siliconcarbide
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
phosphorus
iron
copper
CAS#
if applicable
7440-57-5
7440-38-2
409-21-2
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
0.082
0.001
2.502
0.753
0.226
751.797
1.248
9.082
99.900
496.473
14.487
0.198
0.000
0.177
0.590
589.466
Average
Mass
[%]
0.00
0.00
0.13
0.04
0.01
38.22
0.06
0.46
5.08
25.24
0.74
0.01
0.00
0.01
0.03
29.97
29. August 2013
1966.98 mg
Sum
[%]
Average
Mass
[ppm]
41
0
0.13
1272
383
115
38.27
0.06
382207
635
4617
50789
30.78
0.74
252404
7365
101
0.01
0
90
300
30.01
299681
300071
1000000
101
307810
7365
382705
635
1313
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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