MMBD1010LT1
Switching Diode
Part of the GreenLine
™
Portfolio of devices with
energy−conserving traits.
This switching diode has the following features:
•
Very Low Leakage (≤ 500 pA) promotes extended battery life by
decreasing energy waste. Guaranteed leakage limit is for each diode
in the pair contingent upon the other diode being in a
non−forward−biased condition.
•
Offered in four Surface Mount package types
•
Available in 8 mm Tape and Reel in quantities of 3,000
Applications
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MMBD1010LT1
3
1
2
•
•
•
•
ESD Protection
Reverse Polarity Protection
Steering Logic
Medium−Speed Switching
CASE 318-08, STYLE 9
SOT-23 (TO-236AB)
MMBD2010T1
3
MAXIMUM RATINGS
Rating
Continuous Reverse Voltage
Peak Forward Current
Peak Forward Surge Current
Symbol
V
R
I
F
I
FM
(surge)
1
2
Value
30
200
500
Unit
Vdc
mAdc
mA
CASE 419-02, STYLE 5
SC−70/SOT−323
MMBD3010T1
DEVICE MARKING
MMBD1010LT1 = A5
MMBD2010T1 = DP
MMBD3010T1 = XS
2
1
3
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR-4 Board
(1)
T
A
= 25°C
MMBD1010LT1,
MMBD3010T1
MMBD2010T1
Derate above 25°C MMBD1010LT1,
MMBD3010T1
MMBD2010T1
Thermal Resistance Junction to
Ambient
MMBD1010LT1,
MMBD3010T1
MMBD2010T1
Junction and Storage Temperature
Symbol
P
D
Max
225
150
1.8
1.2
R
θJA
556
833
T
J
, T
stg
−55
to +150
°C
°C/W
Unit
mW
CASE 318D-04, STYLE 3
SC−59
ANODE
1
3
CATHODE
2
ANODE
mW/°C
(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.
Preferred
devices are Motorola recommended choices for future use and best overall value.
©
Semiconductor Components Industries, LLC, 2006
August, 2006
−
Rev. 2
1
Publication Order Number:
MMBD1010LT1/D
MMBD1010LT1
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Reverse Breakdown Voltage (I
BR
= 100
μA)
Reverse Voltage Leakage Current (V
R
= 75 V)
(2)
Forward Voltage (I
F
= 1.0 mA)
Forward Voltage
(I
F
= 10 mA)
Diode Capacitance (V
R
= 0 V, f = 1.0 MHz)
Reverse Recovery Time (I
F
= I
R
= 10 mA) (Figure 1)
V
(BR)
I
R
V
F
C
D
t
rr
30
—
—
—
—
—
—
500
850
950
2.0
3.0
V
pA
mV
pF
μs
Symbol
Min
Max
Unit
(2) Guaranteed leakage limit is for each diode in the pair contingent upon the other diode being
in a non−forward−biased condition.
820
Ω
+10 V
2k
100
μH
0.1
μF
DUT
50
Ω
OUTPUT
PULSE
GENERATOR
50
Ω
INPUT
SAMPLING
OSCILLOSCOPE
90%
V
R
INPUT SIGNAL
I
R
i
R(REC)
= 1 mA
OUTPUT PULSE
(I
F
= I
R
= 10 mA; measured
at i
R(REC)
= 1 mA)
I
F
0.1
μF
t
r
10%
t
p
t
I
F
t
rr
t
Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (I
F
) of 10 mA.
Notes:
2. Input pulse is adjusted so I
R(peak)
is equal to 10 mA.
Notes:
3. t
p
» t
rr
Figure 1. Recovery Time Equivalent Test Circuit
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2
MMBD1010LT1
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
0.037
0.95
0.037
0.95
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.037
0.95
0.037
0.95
0.098-0.118
2.5-3.0
0.094
2.4
0.039
1.0
0.031
0.8
inches
mm
0.079
2.0
0.035
0.9
0.031
0.8
inches
mm
SC−59
0.025
0.025
0.65
0.65
SOT−23
0.91
0.036
0.075
1.9
0.035
0.9
0.028
0.7
inches
mm
2.36
0.093
4.19
0.165
SC−70/SOT−323
The power dissipation for a surface mount device is a
function of the drain/collector pad size. These can vary
from the minimum pad size for soldering to a pad size given
for maximum power dissipation. Power dissipation for a
surface mount device is determined by T
J(max)
, the
maximum rated junction temperature of the die, R
θJA
, the
thermal resistance from the device junction to ambient, and
the operating temperature, T
A
. Using the values provided
on the data sheet, P
D
can be calculated as follows:
P
D
=
T
J(max)
−
T
A
R
θJA
SOD−123
POWER DISSIPATION FOR A SURFACE MOUNT DEVICE
P
D
= 150°C
−
25°C = 225 milliwatts
556°C/W
The 556°C/W for the SOT−23 package assumes the use
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 250
milliwatts. There are other alternatives to achieving higher
power dissipation from the surface mount packages. One is
to increase the area of the drain/collector pad. By
increasing the area of the drain/collector pad, the power
dissipation can be increased. Although the power
dissipation can almost be doubled with this method, area is
taken up on the printed circuit board which can defeat the
purpose of using surface mount technology.
Another alternative would be to use a ceramic substrate
or an aluminum core board such as Thermal Clad™. Using
a board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the
same footprint.
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature T
A
of 25°C,
one can calculate the power dissipation of the device. For
example, for a SOT−23 device, P
D
is calculated as follows.
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3
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
1.22
0.048
mm
inches
MMBD1010LT1
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
•
The soldering temperature and time should not exceed
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
•
Always preheat the device.
•
The delta temperature between the preheat and
soldering should be 100°C or less.*
•
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
260°C for more than 10 seconds.
•
When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
•
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
•
Mechanical stress or shock should not be applied during
cooling
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
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MMBD1010LT1
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular circuit
board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 2 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering systems
but it is a good starting point. Factors that can affect the
profile include the type of soldering system in use, density
and types of components on the board, type of solder used,
and the type of board or substrate material being used. This
profile shows temperature versus time. The line on the
STEP 1
PREHEAT
ZONE 1
RAMP"
200°C
STEP 2
STEP 3
VENT
HEATING
SOAK" ZONES 2 & 5
RAMP"
graph shows the actual temperature that might be
experienced on the surface of a test board at or near a
central solder joint. The two profiles are based on a high
density and a low density board. The Vitronics SMD310
convection/infrared reflow soldering system was used to
generate this profile. The type of solder used was 62/36/2
Tin Lead Silver with a melting point between 177
−189°C.
When this type of furnace is used for solder reflow work, the
circuit boards and solder joints tend to heat first. The
components on the board are then heated by conduction.
The circuit board, because it has a large surface area,
absorbs the thermal energy more efficiently, then distributes
this energy to the components. Because of this effect, the
main body of a component may be up to 30 degrees cooler
than the adjacent solder joints.
STEP 5
STEP 4
HEATING
HEATING
ZONES 3 & 6 ZONES 4 & 7
SPIKE"
SOAK"
170°C
160°C
STEP 6 STEP 7
VENT COOLING
205° TO
219°C
PEAK AT
SOLDER
JOINT
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
150°C
150°C
100°C
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
50°C
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
Figure 2. Typical Solder Heating Profile
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