Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS3800SL
MA000877334
PG-SCT595-5-1
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.331
0.001
0.006
0.018
6.019
0.024
0.055
0.068
0.136
1.242
5.323
0.335
0.142
0.037
0.176
Average
Mass
[%]
2.38
0.01
0.04
0.13
43.25
0.18
0.39
0.49
0.98
8.93
38.26
2.41
1.02
0.27
1.26
29. August 2013
13.92 mg
Sum
[%]
2.38
Average
Mass
[ppm]
23804
87
434
1303
43.43
0.18
432562
1756
3924
4905
9809
89266
49.05
2.41
1.02
382569
24106
10170
2678
1.53
12627
15305
1000000
490473
24106
10170
434386
1756
Sum
[ppm]
23804
wire
encapsulation
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
创意市集
京公网安备 11010802033920号
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