Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS54040-LBA
MA001141654
PG-TSON-24-3
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
5.302
0.021
0.084
1.685
68.425
1.628
0.193
9.925
86.240
2.547
0.378
0.107
0.086
4.100
Average
Mass
[%]
2.93
0.01
0.05
0.93
37.86
0.90
0.11
5.49
47.72
1.41
0.21
0.06
0.05
2.27
29. August 2013
180.72 mg
Sum
[%]
2.93
Average
Mass
[ppm]
29337
117
466
9325
38.85
0.90
378622
9010
1066
54918
53.32
1.41
0.21
477202
14091
2092
594
475
2.38
22685
23754
1000000
533186
14091
2092
388530
9010
Sum
[ppm]
29337
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
< 10%
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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