Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IFX78M05ABTF
MA001121562
PG-TO252-3-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
1.237
0.215
0.065
215.017
0.143
0.271
12.471
122.817
3.740
0.091
0.000
0.040
0.032
1.517
0.019
0.006
19.177
Average
Mass
[%]
0.33
0.06
0.02
57.05
0.04
0.07
3.31
32.59
0.99
0.02
0.00
0.01
0.01
0.40
0.01
0.00
5.09
29. August 2013
376.86 mg
Sum
[%]
0.33
Average
Mass
[ppm]
3283
571
171
57.13
0.04
570551
380
719
33093
35.97
0.99
325897
9924
241
0.02
1
105
84
0.42
4026
51
15
5.10
50888
50954
1000000
4215
242
359709
9924
571293
380
Sum
[ppm]
3283
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com