Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
ESD207-B1-02EL E6327
MA001115166
PG-TSLP-2-19
Material Group
non noble metal
noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
noble metal
noble metal
noble metal
< 10%
Substances
tin
gold
silicon
nickel
copper
carbon black
epoxy resin
silicondioxide
gold
palladium
gold
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-02-0
7440-50-8
1333-86-4
-
60676-86-0
7440-57-5
7440-05-3
7440-57-5
Issued
Weight*
Weight
[mg]
0.000
0.001
0.010
0.241
0.002
0.002
0.048
0.280
0.010
0.000
0.000
Average
Mass
[%]
0.06
0.23
1.68
40.44
0.39
0.28
8.04
47.11
1.75
0.01
0.01
29. August 2013
0.60 mg
Sum
[%]
Average
Mass
[ppm]
587
2273
1.97
40.44
0.39
16847
404450
3927
2771
80362
55.43
1.75
471092
17513
69
0.02
109
178
1000000
554225
17513
19707
404450
3927
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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