= 11.3 A Peak; Pulse Width = 1 to 2 ms, Duty Cycle
t
2%)
Gate Trigger Current (Continuous dc)
(V
D
= 12 Vdc, R
L
= 12Ω)
Trigger Mode
MT2(+), Gate(+); MT2(+), Gate(−); MT2(−), Gate(−)
MT2(−), Gate(+) “A” SUFFIX ONLY
Gate Trigger Voltage (Continuous dc)
(Main Terminal Voltage = 12 Vdc, R
L
= 100 Ohms)
MT2(+), G(+)
MT2(+), G(−)
MT2(−), G(−)
MT2(−), G(+) “A” SUFFIX ONLY
(Main Terminal Voltage = Rated V
DRM
, R
L
= 10 kΩ, T
J
= +125°C)
MT2(+), G(+); MT2(−), G(−); MT2(+), G(−)
MT2(−), G(+) “A” SUFFIX ONLY
Holding Current (Either Direction)
(V
D
= 24 Vdc, Gate Open,
Initiating Current = 200 mA)
Critical Rate of Rise of Commutating Off-State Voltage
(V
D
= Rated V
DRM
, I
TM
= 11.3 A, Commutating
di/dt = 4.1 A/ms, Gate Unenergized, T
C
= 80°C)
Critical Rate of Rise of Off-State Voltage
(V
D
= Rated V
DRM
, Exponential Voltage Rise, Gate Open,
T
J
= 125°C)
V
TM
I
GT
—
—
V
GT
—
—
—
—
0.2
0.2
I
H
—
—
—
50
75
Volts
0.9
0.9
1.1
1.4
—
—
—
2
2
2
2.5
—
—
50
mA
dv/dt(c)
—
5
—
V/μs
dv/dt
—
100
—
V/μs
FIGURE 1 — CURRENT DERATING
P(AV), AVERAGE POWER DISSIPATION (WATTS)
125
TC, MAXIMUM ALLOWABLE CASE
TEMPERATURE (
°
C)
115
105
95
85
75
10
8.0
6.0
4.0
2.0
0
FIGURE 2 — POWER DISSIPATION
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
I
T(RMS)
, RMS ON STATE CURRENT (AMPS)
I
T(RMS)
RMS ON STATE CURRENT (AMPS)
http://onsemi.com
2
MAC218
VGT , NORMALIZED GATE TRIGGER VOLTAGE (VOLTS)
IGT, NORMALIZED GATE TRIGGER CURRENT (mA)
FIGURE 3 — NORMALIZED GATE TRIGGER
CURRENT
5.0
OFF-STATE VOLTAGE = 12 V
3.0
2.0
1
2
3
4
1.8
1.6
1.4
1.2
1.0
0.8
0.6
FIGURE 4 — NORMALIZED GATE TRIGGER
VOLTAGE
OFF-STATE VOLTAGE = 12 V
QUADRANT 4
1.0
0.7
QUADRANT
QUADRANTS
1
2
3
0.5
−60
−40
−20
0
20
40
60
80
100
120
140
0.4
−60
−40
−20
0
20
40
60
80
100
120
140
T
J
, JUNCTION TEMPERATURE (°C)
T
J
, JUNCTION TEMPERATURE (°C)
FIGURE 5 — NORMALIZED HOLDING CURRENT
I H , NORMALIZED HOLDING CURRENT (mA)
2.0
GATE OPEN
MAIN TERMINAL #1
POSITIVE
1.0
0.7
0.5
MAIN TERMINAL #2
POSITIVE
0.3
0.2
−60
−40
−20
0
20
40
60
80
100
120
140
T
J
, JUNCTION TEMPERATURE (°C)
http://onsemi.com
3
MAC218
PACKAGE DIMENSIONS
CASE 221A-04
(TO−220AB)
−T−
B
F
T
C
SEATING
PLANE
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.147
0.095
0.105
0.110
0.155
0.014
0.022
0.500
0.562
0.045
0.055
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
−−−
−−−
0.080
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.88
3.61
3.73
2.42
2.66
2.80
3.93
0.36
0.55
12.70
14.27
1.15
1.39
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
−−−
−−−
2.04
Q
H
Z
L
V
G
4
1 2 3
A
U
K
STYLE 4:
PIN 1.
2.
3.
4.
MAIN TERMINAL 1
MAIN TERMINAL 2
GATE
MAIN TERMINAL 2
R
J
D
N
ON Semiconductor
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