Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BSS806NE H6327
MA001097682
PG-SOT23-3-5
Material Group
non noble metal
noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
tin
gold
silicon
chromium
silicon
titanium
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-47-3
7440-21-3
7440-32-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.004
0.017
0.261
0.009
0.001
0.003
3.000
0.073
0.056
1.208
4.353
0.150
0.284
Average
Mass
[%]
0.05
0.18
2.77
0.10
0.01
0.03
31.86
0.77
0.60
12.82
46.20
1.59
3.02
29. August 2013
9.42 mg
Sum
[%]
Average
Mass
[ppm]
468
1816
3.00
27707
960
64
320
32.00
0.77
318553
7722
5963
128206
59.62
1.59
3.02
462137
15887
30197
596306
15887
30197
1000000
319897
7722
29991
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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