Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD50R650CE
MA001048796
PG-TO252-3-341
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
plastics
organic material
plastics
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
antimonytrioxide
brominated resin
carbon black
epoxy resin
silicondioxide
tin
nickel
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1309-64-4
-
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
2.436
0.248
0.075
248.124
0.410
1.733
1.856
1.980
16.707
101.477
3.740
0.509
0.061
0.049
2.327
Average
Mass
[%]
0.64
0.07
0.02
64.99
0.11
0.45
0.49
0.52
4.38
26.58
0.98
0.13
0.02
0.01
0.61
29. August 2013
381.73 mg
Sum
[%]
0.64
Average
Mass
[ppm]
6382
651
195
65.08
0.11
649995
1075
4539
4863
5187
43765
32.42
0.98
0.13
265833
9798
1333
160
128
0.64
6096
6384
1000000
324187
9798
1333
650841
1075
Sum
[ppm]
6382
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
