Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X5R, 15% TC, 2.2uF, Surface Mount, 0603, CHIP
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
Objectid | 1687886608 |
包装说明 | , 0603 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
电容 | 2.2 µF |
电容器类型 | CERAMIC CAPACITOR |
介电材料 | CERAMIC |
JESD-609代码 | e0 |
制造商序列号 | LD |
安装特点 | SURFACE MOUNT |
多层 | Yes |
负容差 | 10% |
端子数量 | 2 |
最高工作温度 | 85 °C |
最低工作温度 | -55 °C |
封装形状 | RECTANGULAR PACKAGE |
包装方法 | TR, PAPER, 7 INCH |
正容差 | 10% |
额定(直流)电压(URdc) | 16 V |
尺寸代码 | 0603 |
表面贴装 | YES |
温度特性代码 | X5R |
温度系数 | 15% ppm/°C |
端子面层 | Tin/Lead (Sn/Pb) |
端子形状 | WRAPAROUND |
LD03YD225KAX2A | LD106D476KAX2A | LD106D476KAX4A | LD03YD225KAX4A | LD02ZD104MAX2A | LD02ZD104MAX4A | |
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描述 | Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X5R, 15% TC, 2.2uF, Surface Mount, 0603, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 10% +Tol, 10% -Tol, X5R, 15% TC, 47uF, Surface Mount, 1210, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 10% +Tol, 10% -Tol, X5R, 15% TC, 47uF, Surface Mount, 1210, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 16V, 10% +Tol, 10% -Tol, X5R, 15% TC, 2.2uF, Surface Mount, 0603, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 10V, 20% +Tol, 20% -Tol, X5R, 15% TC, 0.1uF, Surface Mount, 0402, CHIP | Ceramic Capacitor, Multilayer, Ceramic, 10V, 20% +Tol, 20% -Tol, X5R, 15% TC, 0.1uF, Surface Mount, 0402, CHIP |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Objectid | 1687886608 | 1687887833 | 1687887834 | 1687886609 | 1687886012 | 1687886013 |
包装说明 | , 0603 | , 1210 | , 1210 | , 0603 | , 0402 | , 0402 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
电容 | 2.2 µF | 47 µF | 47 µF | 2.2 µF | 0.1 µF | 0.1 µF |
电容器类型 | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
介电材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
制造商序列号 | LD | LD | LD | LD | LD | LD |
安装特点 | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
多层 | Yes | Yes | Yes | Yes | Yes | Yes |
负容差 | 10% | 10% | 10% | 10% | 20% | 20% |
端子数量 | 2 | 2 | 2 | 2 | 2 | 2 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装形状 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
包装方法 | TR, PAPER, 7 INCH | TR, EMBOSSED, 7 INCH | TR, EMBOSSED, 13 INCH | TR, PAPER, 13 INCH | TR, PAPER, 7 INCH | TR, PAPER, 13 INCH |
正容差 | 10% | 10% | 10% | 10% | 20% | 20% |
额定(直流)电压(URdc) | 16 V | 6.3 V | 6.3 V | 16 V | 10 V | 10 V |
尺寸代码 | 0603 | 1210 | 1210 | 0603 | 0402 | 0402 |
表面贴装 | YES | YES | YES | YES | YES | YES |
温度特性代码 | X5R | X5R | X5R | X5R | X5R | X5R |
温度系数 | 15% ppm/°C | 15% ppm/°C | 15% ppm/°C | 15% ppm/°C | 15% ppm/°C | 15% ppm/°C |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形状 | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND |
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