1 ELEMENT, 0.82 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 组成, 0.82 uH, 瓷芯, 通用电感, 表面贴装
| 参数名称 | 属性值 |
| 额定感应系数 | 0.8200 µH |
| 功能数量 | 1 |
| 端子数量 | 2 |
| 最小工作温度 | -40 Cel |
| 最大工作温度 | 140 Cel |
| 自谐振频率 | 310 MHz |
| 加工封装描述 | CHIP, 0907, ROHS COMPLIANT |
| each_compli | Yes |
| 欧盟RoHS规范 | Yes |
| 状态 | Active |
| 电感类型 | GENERAL PURPOSE INDUCTOR |
| case_size_code | 0907 |
| 结构 | Chip |
| 核心材料 | CERAMIC |
| 直流电阻 | 2.35 ohm |
| 电感应用 | RF INDUCTOR |
| jesd_609_code | e4 |
| 制造商系列 | 0805CS |
| ckage_heigh | 1.52 mm |
| ckage_length | 2.29 mm |
| ckage_style__meter_ | SMT |
| ckage_width | 1.73 mm |
| cking_method | TR |
| 1额定值的最小品质因数 | 23 |
| 最大额定电流 | 0.1800 A |
| series | 0805CS |
| 形状大小描述 | RECTANGULAR PACKAGE |
| 隔离 | NO |
| 特殊功能 | Q MEASURED AT 50 MHZ |
| 表面贴装 | YES |
| 端子涂层 | SILVER PALLADIUM PLATINUM |
| 端子布局 | DUAL ENDED |
| 端子形状 | WRAPAROUND |
| 测试频率 | 25 MHz |
| 偏差 | 5 % |

| F1763 | 0805CS-821XJLB | 142-0701-851 | ERJ-2RKF1212X | IDTF1763NBGI | LQW15AN22NJ00D | TC4-6TG2 | |
|---|---|---|---|---|---|---|---|
| 描述 | 1 ELEMENT, 0.82 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 0.82 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | BOARD TERMINATED, FEMALE, SMA CONNECTOR, SOLDER, RECEPTACLE | 1 ELEMENT, 0.82 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 0.82 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | INDUCTOR 22NH 310MA 0402 | 1 ELEMENT, 0.82 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 额定感应系数 | 0.8200 µH | 0.8200 µH | - | 0.8200 µH | 0.8200 µH | - | 0.8200 µH |
| 功能数量 | 1 | 1 | - | 1 | 1 | - | 1 |
| 端子数量 | 2 | 2 | - | 2 | 2 | - | 2 |
| 最小工作温度 | -40 Cel | -40 Cel | - | -40 Cel | -40 Cel | - | -40 Cel |
| 最大工作温度 | 140 Cel | 140 Cel | - | 140 Cel | 140 Cel | - | 140 Cel |
| 自谐振频率 | 310 MHz | 310 MHz | - | 310 MHz | 310 MHz | - | 310 MHz |
| 加工封装描述 | CHIP, 0907, ROHS COMPLIANT | CHIP, 0907, ROHS COMPLIANT | - | CHIP, 0907, ROHS COMPLIANT | CHIP, 0907, ROHS COMPLIANT | - | CHIP, 0907, ROHS COMPLIANT |
| each_compli | Yes | Yes | - | Yes | Yes | - | Yes |
| 欧盟RoHS规范 | Yes | Yes | Yes | Yes | Yes | - | Yes |
| 状态 | Active | Active | TRANSFERRED | Active | Active | - | Active |
| 电感类型 | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | - | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | - | GENERAL PURPOSE INDUCTOR |
| case_size_code | 0907 | 0907 | - | 0907 | 0907 | - | 0907 |
| 结构 | Chip | Chip | - | Chip | Chip | - | Chip |
| 核心材料 | CERAMIC | CERAMIC | - | CERAMIC | CERAMIC | - | CERAMIC |
| 直流电阻 | 2.35 ohm | 2.35 ohm | - | 2.35 ohm | 2.35 ohm | - | 2.35 ohm |
| 电感应用 | RF INDUCTOR | RF INDUCTOR | - | RF INDUCTOR | RF INDUCTOR | - | RF INDUCTOR |
| jesd_609_code | e4 | e4 | - | e4 | e4 | - | e4 |
| 制造商系列 | 0805CS | 0805CS | SMA | 0805CS | 0805CS | - | 0805CS |
| ckage_heigh | 1.52 mm | 1.52 mm | - | 1.52 mm | 1.52 mm | - | 1.52 mm |
| ckage_length | 2.29 mm | 2.29 mm | - | 2.29 mm | 2.29 mm | - | 2.29 mm |
| ckage_style__meter_ | SMT | SMT | - | SMT | SMT | - | SMT |
| ckage_width | 1.73 mm | 1.73 mm | - | 1.73 mm | 1.73 mm | - | 1.73 mm |
| cking_method | TR | TR | - | TR | TR | - | TR |
| 1额定值的最小品质因数 | 23 | 23 | - | 23 | 23 | - | 23 |
| 最大额定电流 | 0.1800 A | 0.1800 A | - | 0.1800 A | 0.1800 A | - | 0.1800 A |
| series | 0805CS | 0805CS | - | 0805CS | 0805CS | - | 0805CS |
| 形状大小描述 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | - | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | - | RECTANGULAR PACKAGE |
| 隔离 | NO | NO | - | NO | NO | - | NO |
| 特殊功能 | Q MEASURED AT 50 MHZ | Q MEASURED AT 50 MHZ | - | Q MEASURED AT 50 MHZ | Q MEASURED AT 50 MHZ | - | Q MEASURED AT 50 MHZ |
| 表面贴装 | YES | YES | - | YES | YES | - | YES |
| 端子涂层 | SILVER PALLADIUM PLATINUM | SILVER PALLADIUM PLATINUM | - | SILVER PALLADIUM PLATINUM | SILVER PALLADIUM PLATINUM | - | SILVER PALLADIUM PLATINUM |
| 端子布局 | DUAL ENDED | DUAL ENDED | - | DUAL ENDED | DUAL ENDED | - | DUAL ENDED |
| 端子形状 | WRAPAROUND | WRAPAROUND | - | WRAPAROUND | WRAPAROUND | - | WRAPAROUND |
| 测试频率 | 25 MHz | 25 MHz | - | 25 MHz | 25 MHz | - | 25 MHz |
| 偏差 | 5 % | 5 % | - | 5 % | 5 % | - | 5 % |
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