Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
wire
encapsulation
ESD201-B2-03LRH E6327
MA001010440
PG-TSLP-3-9
Material Group
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
noble metal
noble metal
non noble metal
noble metal
< 10%
Substances
silicon
nickel
gold
carbon black
epoxy resin
silicondioxide
gold
silver
tin
gold
CAS#
if applicable
7440-21-3
7440-02-0
7440-57-5
1333-86-4
-
60676-86-0
7440-57-5
7440-22-4
7440-31-5
7440-57-5
Issued
Weight*
Weight
[mg]
0.020
0.131
0.009
0.003
0.040
0.252
0.011
0.017
0.029
0.112
Average
Mass
[%]
3.21
21.03
1.40
0.47
6.38
40.40
1.70
2.78
4.64
17.99
29. August 2013
0.62 mg
Sum
[%]
3.21
21.03
1.40
Average
Mass
[ppm]
32118
210260
14047
4726
63786
47.25
1.70
2.78
403983
17002
27763
46394
22.63
179921
226315
1000000
472495
17002
27763
Sum
[ppm]
32118
210260
14047
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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