Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IDP40E65D2
MA001009770
PG-TO220-2-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
1.233
0.753
0.226
751.797
7.668
5.968
113.390
477.430
14.487
0.198
0.000
0.138
0.345
0.898
0.590
0.177
589.466
Average
Mass
[%]
0.06
0.04
0.01
38.26
0.39
0.30
5.77
24.30
0.74
0.01
0.00
0.01
0.02
0.05
0.03
0.01
30.00
29. August 2013
1964.76 mg
Sum
[%]
0.06
Average
Mass
[ppm]
627
383
115
38.31
0.39
382640
3903
3037
57712
30.37
0.74
242996
7373
101
0.01
1
70
176
0.08
457
300
90
30.04
300019
300409
1000000
703
101
303745
7373
383139
3903
Sum
[ppm]
627
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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