Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IDW30G65C5
MA001003350
PG-TO247-3-41
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
siliconcarbide
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
phosphorus
iron
copper
CAS#
if applicable
409-21-2
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.933
0.530
0.159
529.068
3.058
20.063
381.204
1605.071
31.874
29.065
0.100
0.250
0.650
1.033
3.442
3438.006
Average
Mass
[%]
0.03
0.01
0.00
8.75
0.05
0.33
6.31
26.55
0.53
0.48
0.00
0.00
0.01
0.02
0.06
56.87
29. August 2013
6045.51 mg
Sum
[%]
0.03
Average
Mass
[ppm]
320
88
26
8.76
0.05
87514
506
3319
63056
33.19
0.53
0.48
265498
5272
4808
17
41
0.01
108
171
569
56.95
568687
569427
1000000
166
331873
5272
4808
87628
506
Sum
[ppm]
320
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com