Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BSZ0908ND
MA000987418
PG-WISON-8-1
Material Group
non noble metal
noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
tin
gold
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.011
0.041
0.214
0.003
0.012
0.230
9.354
0.274
0.025
1.288
11.195
0.360
0.076
Average
Mass
[%]
0.05
0.18
0.93
0.01
0.05
1.00
40.52
1.19
0.11
5.58
48.49
1.56
0.33
29. August 2013
23.08 mg
Sum
[%]
Average
Mass
[ppm]
456
1770
1.16
9258
125
499
9980
41.58
1.19
405246
11877
1084
55815
54.18
1.56
0.33
484993
15603
3294
541892
15603
3294
1000000
415850
11877
11484
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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