Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IFX8117ME V33
MA000832208
PG-SOT223-4-18
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
1.302
0.010
0.051
0.153
50.679
0.321
0.460
0.575
1.149
10.456
44.812
1.464
0.768
0.073
0.343
Average
Mass
[%]
1.16
0.01
0.05
0.14
45.01
0.28
0.41
0.51
1.02
9.28
39.79
1.30
0.68
0.06
0.30
29. August 2013
112.61 mg
Sum
[%]
1.16
Average
Mass
[ppm]
11558
90
452
1356
45.21
0.28
450023
2846
4081
5102
10203
92850
51.01
1.30
0.68
397929
13000
6817
646
0.36
3047
3693
1000000
510165
13000
6817
451921
2846
Sum
[ppm]
11558
wire
encapsulation
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
电子竞赛
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
