Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
IDD03SG60C
MA000809442
PG-TO252-3-311
Material Group
noble metal
non noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
< 10%
Substances
gold
tin
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
CAS#
if applicable
7440-57-5
7440-31-5
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
Issued
Weight*
Weight
[mg]
0.032
0.008
0.401
0.162
0.049
162.275
0.126
1.449
25.351
118.065
3.740
0.086
0.000
Average
Mass
[%]
0.01
0.00
0.13
0.05
0.02
52.06
0.04
0.46
8.13
37.87
1.20
0.03
0.00
29. August 2013
311.74 mg
Sum
[%]
Average
Mass
[ppm]
101
26
0.14
1288
521
156
52.13
0.04
520539
403
4647
81321
46.46
1.20
378723
11997
277
0.03
1
278
1000000
464691
11997
521216
403
1415
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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