Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS432E2 E3062A
MA000668708
PG-TO263-5-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
inorganic material
plastics
plastics
inorganic material
non noble metal
inorganic material
non noble metal
plastics
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
phosphorus
nickel
Polyimide
tin
silver
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
1309-64-4
-
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
26023-21-2
7440-31-5
7440-22-4
7439-92-1
Issued
Weight*
Weight
[mg]
13.065
0.898
0.269
896.470
1.499
6.246
13.059
14.762
107.880
425.841
4.660
0.423
4.092
0.326
0.101
0.126
4.820
Average
Mass
[%]
0.87
0.06
0.02
59.99
0.10
0.42
0.87
0.99
7.22
28.49
0.31
0.03
0.27
0.02
0.01
0.01
0.32
29. August 2013
1494.54 mg
Sum
[%]
0.87
Average
Mass
[ppm]
8742
601
180
60.07
0.10
599831
1003
4179
8738
9878
72183
37.99
0.31
284931
3118
283
0.30
0.02
2738
218
68
84
0.34
3225
3377
1000000
3021
218
379909
3118
600612
1003
Sum
[ppm]
8742
wire
encapsulation
leadfinish
plating
glue
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com