Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSZ120P03NS3E G
MA000734162
PG-TSDSON-8-2
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
tin
silver
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-31-5
7440-22-4
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.346
0.002
0.008
0.168
6.808
0.053
0.035
1.783
15.494
0.387
0.963
0.030
0.037
1.426
0.001
0.004
0.086
3.501
0.002
0.008
0.151
6.127
Average
Mass
[%]
3.50
0.01
0.02
0.44
17.72
0.14
0.09
4.64
40.33
1.01
2.51
0.08
0.10
3.71
0.00
0.01
0.22
9.11
0.00
0.02
0.39
15.95
29. August 2013
38.42 mg
Sum
[%]
3.50
Average
Mass
[ppm]
35023
55
218
4364
18.19
0.14
177191
1381
901
46412
45.06
1.01
2.51
403289
10077
25054
777
972
3.89
37121
28
112
2244
9.34
91129
49
196
3928
16.36
159479
163652
1000000
93513
38870
450602
10077
25054
181828
1381
Sum
[ppm]
35023
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
leadfinish
plating
solder
heatspreader
heat sink CLIP
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
