Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS4880R
MA000679030
PG-DSO-36-26
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
16.733
0.383
1.533
30.652
1244.598
4.281
1.443
66.356
653.457
16.150
0.741
0.151
0.100
9.784
Average
Mass
[%]
0.82
0.02
0.07
1.50
60.82
0.21
0.07
3.24
31.93
0.79
0.04
0.01
0.00
0.48
29. August 2013
2046.36 mg
Sum
[%]
0.82
Average
Mass
[ppm]
8177
187
749
14979
62.41
0.21
608201
2092
705
32426
35.24
0.79
0.04
319326
7892
362
74
49
0.49
4781
4904
1000000
352457
7892
362
624116
2092
Sum
[ppm]
8177
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
< 10%
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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