Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS5016-1EKB
MA001109716
PG-DSO-14-47
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.081
0.017
0.069
1.383
56.175
0.560
0.169
7.758
76.398
2.472
1.470
0.164
0.774
Average
Mass
[%]
2.05
0.01
0.05
0.92
37.33
0.37
0.11
5.16
50.76
1.64
0.98
0.11
0.51
29. August 2013
150.49 mg
Sum
[%]
2.05
Average
Mass
[ppm]
20471
115
460
9193
38.31
0.37
373278
3724
1121
51551
56.03
1.64
0.98
507660
16424
9770
1091
0.62
5142
6233
1000000
560332
16424
9770
383046
3724
Sum
[ppm]
20471
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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