Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BSP322P H6327
MA001097592
PG-SOT223-4-21
Material Group
noble metal
non noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
gold
tin
silicon
silicon
titanium
chromium
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-57-5
7440-31-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.074
0.019
0.835
0.010
0.051
0.152
50.489
0.058
0.600
8.998
50.391
1.464
0.513
Average
Mass
[%]
0.06
0.02
0.73
0.01
0.04
0.13
44.43
0.05
0.53
7.92
44.34
1.29
0.45
29. August 2013
113.65 mg
Sum
[%]
Average
Mass
[ppm]
648
167
0.81
7344
89
446
1338
44.61
0.05
444236
509
5278
79174
52.79
1.29
0.45
443376
12881
4514
527828
12881
4514
1000000
446109
509
8159
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
微控制器 MCU
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