Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS50050-1EGA
MA001080468
PG-DSO-12-16
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
gold
aluminium
carbon black
epoxy resin
silicondioxide
tin
silver
Polyimide
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-57-5
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
26023-21-2
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
7.100
0.230
0.069
230.106
0.180
1.385
0.296
21.179
126.627
4.235
2.172
0.205
0.103
0.082
3.923
Average
Mass
[%]
1.78
0.06
0.02
57.83
0.05
0.35
0.07
5.32
31.82
1.06
0.55
0.05
0.03
0.02
0.99
29. August 2013
397.89 mg
Sum
[%]
1.78
Average
Mass
[ppm]
17843
579
174
57.91
578314
452
0.40
3480
744
53227
37.21
1.06
0.55
0.05
318245
10644
5459
514
258
207
1.04
9860
10325
1000000
372216
10644
5459
514
3932
579067
Sum
[ppm]
17843
wire
encapsulation
leadfinish
plating
glue
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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