3.1-W Mono, Fully Differential, Class-AB Audio Amplifier 8-SON -40 to 85
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | SON |
包装说明 | HVSON, SOLCC8,.12,25 |
针数 | 8 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 6 weeks |
标称带宽 | 20 kHz |
商用集成电路类型 | AUDIO AMPLIFIER |
谐波失真 | 10% |
JESD-30 代码 | S-PDSO-N8 |
JESD-609代码 | e4 |
长度 | 3 mm |
湿度敏感等级 | 2 |
标称噪声指数 | 105 dB |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
标称输出功率 | 3.1 W |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVSON |
封装等效代码 | SOLCC8,.12,25 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 3/5 V |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
TPA6211A1DRBRG4 | P6KE180A | P6KE20 | TPA6211A1DGNRG4 | TPA6211A1DRB | TPA6211A1DRBG4 | |
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描述 | 3.1-W Mono, Fully Differential, Class-AB Audio Amplifier 8-SON -40 to 85 | Transient Voltage Suppressor | Transient Voltage Suppressor | 3.1-W Mono, Fully Differential, Class-AB Audio Amplifier 8-MSOP-PowerPAD -40 to 85 | 3.1-W Mono, Fully Differential, Class-AB Audio Amplifier 8-SON -40 to 85 | 3.1-W Mono, Fully Differential, Class-AB Audio Amplifier 8-SON -40 to 85 |
Brand Name | Texas Instruments | - | - | Texas Instruments | Texas Instruments | Texas Instruments |
是否Rohs认证 | 符合 | - | - | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | SON | - | - | MSOP | SON | SON |
包装说明 | HVSON, SOLCC8,.12,25 | - | - | HTSSOP, TSSOP8,.19 | HVSON, SOLCC8,.12,25 | SON-8 |
针数 | 8 | - | - | 8 | 8 | 8 |
Reach Compliance Code | compli | - | - | compli | compli | compli |
ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
标称带宽 | 20 kHz | - | - | 20 kHz | 20 kHz | 20 kHz |
商用集成电路类型 | AUDIO AMPLIFIER | - | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
谐波失真 | 10% | - | - | 10% | 10% | 10% |
JESD-30 代码 | S-PDSO-N8 | - | - | S-PDSO-G8 | S-PDSO-N8 | S-PDSO-N8 |
JESD-609代码 | e4 | - | - | e4 | e4 | e4 |
长度 | 3 mm | - | - | 3 mm | 3 mm | 3 mm |
湿度敏感等级 | 2 | - | - | 1 | 2 | 2 |
信道数量 | 1 | - | - | 1 | 1 | 1 |
功能数量 | 1 | - | - | 1 | 1 | 1 |
端子数量 | 8 | - | - | 8 | 8 | 8 |
最高工作温度 | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
标称输出功率 | 3.1 W | - | - | 2.45 W | 2.45 W | 2.45 W |
封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVSON | - | - | HTSSOP | HVSON | HVSON |
封装等效代码 | SOLCC8,.12,25 | - | - | TSSOP8,.19 | SOLCC8,.12,25 | SOLCC8,.12,25 |
封装形状 | SQUARE | - | - | SQUARE | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | - | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | - | - | 260 | 260 | 260 |
电源 | 3/5 V | - | - | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | - | - | 1.1 mm | 1 mm | 1 mm |
最大供电电压 (Vsup) | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.5 V | - | - | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | - | - | YES | YES | YES |
技术 | CMOS | - | - | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | - | - | GULL WING | NO LEAD | NO LEAD |
端子节距 | 0.65 mm | - | - | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | - | - | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3 mm | - | - | 3 mm | 3 mm | 3 mm |
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