D58V0M4U8MR
58V UNIDIRECTIONAL TVS DIODE ARRAY
Features
2.7kW Peak Pulse Power (tp = 8x20µs)
Provides ESD Protection per IEC 61000-4-2 Standard:
Air
±30kV,
Contact
±30kV
4 Channels of ESD Protection and 4 Decoupling Capacitances
Typically Used in Power Over Ethernet PSE Equipment against
Line Overvoltages
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
SO-8
PS1
GND
GND
PS2
Mechanical Data
Case: SO-8
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Weight: 0.08 grams (approximate)
ADVANCED NEW PRODUCT
INFORMATION
PS4
GND
GND
PS3
Top View
Top View
Pin Configuration
Device Schematic
Ordering Information
(Note 4)
D58V0 M X B X XXX- XX
Voltage
Capacitance
# of Channels
1: 1 Channel
2: 2 Channels
4: 4 Channels
6: 6 Channels
Polarity
B: Bidirectional
(Symmetrical)
U: Unidirectional
A: Bidirectional
(Asymmetrical)
# of Pins
2: 2 Pins
3: 3 Pins
5: 5 Pins
6: 6 Pins
8: 8 Pins
10: 10 Pins
Package
LP3: X3-DFN0603-2
LP: X1-DFN1006-2
LP4: X2-DFN1006-2
WS: SOD323
T: SOD523/SOT523
SO: SOT23/SOT25
W: SOD123/SOT323
TS: TSOT25/TSOT26
S: SOT353/SOT363
V:SOT553/SOT563
Tape width(mm)
12
Packing
7: 7” reel
7B: 7” reel (DFN1006
Package Only)
13: 13” reel
5V0: 5.0 Volts X: Extremely Low (<0.5pF)
58V0: 58.0 Volts F: Ultra Low (0.5 ~ 1.0pF)
P: Very Low (1.1 ~ 10pF)
L: Low (10.1 ~ 20pF)
M: Medium (>20pF)
Product
D58V0M4U8MR-13
Notes:
Compliance
Standard
Marking
TV58
Reel size(inches)
13
Quantity per reel
2500/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Top View
8
5
Logo
TV58
YY WW
1
4
1 of 5
www.diodes.com
April 2014
© Diodes Incorporated
Part Marking
Xth week: 01 ~ 53
Year: “13” = 2013
D58V0M4U8MR
Document number: DS36183 Rev. 2 - 2
D58V0M4U8MR
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.), Per Element
Characteristic
Peak Pulse Power Dissipation
Peak Pulse Current
ESD Protection – Contact Discharge
Symbol
P
PP
I
PP
Value
2700
24
±30
±30
Unit
W
A
kV
kV
Conditions
8/20µs, Per Figure 1
8/20µs, Per Figure 1
IEC 61000-4-2 Standard
IEC 61000-4-2 Standard
ADVANCED NEW PRODUCT
INFORMATION
ESD Protection – Air Discharge
V
ESD_Contact
V
ESD_Air
Thermal Characteristics
Characteristic
Package Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Symbol
P
D
R
θJA
T
J
, T
STG
Value
1.0
125
-65 to +150
Unit
W
°C/W
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Reverse Standoff Voltage
Channel Leakage Current (Note 6)
Breakdown Voltage
Clamping Voltage
Channel Input Capacitance
Notes:
Symbol
V
RWM
I
RM
V
BR
V
CL
C
T
Min
—
—
64.4
—
—
Typ
—
—
—
—
55
Max
58
0.2
71.2
100
—
Unit
V
μA
V
V
pF
Test Conditions
—
V
RWM
= 58V
I
R
= 1mA
I
PP
= 24A, t
p
= 8/20μS
V
R
= 50V, f = 1MHz
5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
110
P
PP
(T
J
INITIAL)/ P
PP
(T
J
INITIAL = 25°C)
100
90
80
70
60
50
40
30
20
10
0
0
25
75
100
125
150
T
J
(°C)
Figure 2 Peak Power Dissipation vs.
Initial Junction Temperature
50
175
I
PP
, PEAK PULSE CURRENT (%I
pp
)
100
Peak Value I
pp
Half Value I
pp
/2
50
0
8x20 Waveform
as defined by R.E.A.
0
20
40
60
t, TIME (
s)
Figure 1 Pulse Waveform
D58V0M4U8MR
Document number: DS36183 Rev. 2 - 2
2 of 5
www.diodes.com
April 2014
© Diodes Incorporated
D58V0M4U8MR
100.0
T
J
Initial = 25°C
100.0
10.0
P
PP
(kW)
10.0
I
PP
(A)
ADVANCED NEW PRODUCT
INFORMATION
1.0
1.0
T
J
Initial = 25°C
8/20µs
1.0E-01
1.0E+00
1.0E+01
tp (mS)
Figure 3 Peak Pulse Power vs. Exponential Pulse Duration
(T
J
Initial = 25°C)
1000
f = 1MHz
V
OSC
= 30mV
RMS
T
J
= 25°C
0.1
1.0E-03
1.0E-02
0.1
70
90
100
V
CL
(V)
Figure 4 Clamping Voltage vs. Peak Pulse Current
(Exponential Waveform, Maximum Values)
80
1.0E+01
1.0E+00
C
T
(pF)
100
I
FM
(A)
1.0E-01
T
J
= 25°C
T
J
= 125°C
10
40
50
55
V
R
(V)
Figure 5 Capacitance vs. Voltage (typical values)
45
1.0E-02
0
1
1.5
V
FM
(V)
Figure 6 Peak Forward Voltage Drop vs.
Peak Forward Current (typical values)
0.5
1
1.E+04
V
R
= V
RWM
1.E+03
Zth(j-a)/ Rth(j-a)
1.E+02
I
R
(nA)
0.1
1.E+01
1.E+00
1.E-01
0.01
1.0E-03
t
P
(s)
Figure 7 Relative Variation of Thermal Impedance
Junction Ambient vs. Pulse Duration
1.0E-01
1.0E+01
1.0E+03
1.E-02
25
100
125
150
T
J
(°C)
Figure 8 Leakage Current vs. Junction Temperature
(typical values)
50
75
D58V0M4U8MR
Document number: DS36183 Rev. 2 - 2
3 of 5
www.diodes.com
April 2014
© Diodes Incorporated
D58V0M4U8MR
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
ADVANCED NEW PRODUCT
INFORMATION
E1 E
A1
L
Gauge Plane
Seating Plane
Detail ‘A’
h
A2 A A3
e
D
b
7
°~
9
°
45
°
Detail ‘A’
SO-8
Dim
Min
Max
A
-
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
-
0.35
L
0.62
0.82
0
8
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X
0.254
C1
C2
Y
Dimensions
X
Y
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
D58V0M4U8MR
Document number: DS36183 Rev. 2 - 2
4 of 5
www.diodes.com
April 2014
© Diodes Incorporated
D58V0M4U8MR
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
ADVANCED NEW PRODUCT
INFORMATION
D58V0M4U8MR
Document number: DS36183 Rev. 2 - 2
5 of 5
www.diodes.com
April 2014
© Diodes Incorporated
DSP 与 ARM 处理器
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
