MN101E16 Series
Type
Internal ROM type
ROM (byte)
RAM (byte)
Package (Lead-free)
Minimum Instruction
Execution Time
256K
MN101E16K
Mask ROM
384K
260K
MN101E16Y
MN101EF16K
FLASH
512K
MN101EF16Z
12K
20K
16K
30K
LQFP100-P-1414,
LQFP100-P-1414,
QFP100-P-1818B
QFP100-P-1818B
QFP100-P-1818B
QFP100-P-1818B
0.0588
µs (at
2.7
V to
3.6
V,
17
MHz, at internal
2, 4, 8
times oscillation))
0.1
µs (at
2.7
V to
3.6
V,
20
MHz)
30.6
µs (at
2.7
V to
3.6
V,
32.768
kHz)
Interrupts
RESET. Watchdog. External
0
to
5.
Timer
0
to
3.
Timer
6.
Timer
7
(2 systems). Timer A to E.Time base. Serial
0
(2 systems). Serial
1
(2
systems). Serial
2.
Serial
3
(2 systems). Serial
4
(2 systems). Automatic transfer finish (2 systems). A/D conversion finish. Key interrupt
Timer Counter
8-bit
timer
×
10
Timer
0
..................Square-wave/8-bit PWM output. Event count. Pulse width measurement. Real time output control
Timer
1
..................Square-wave output. Event count. Synchronous output event
Timer
2
..................Square-wave/8-bit PWM output. Event count. Synchronous output event. Pulse width measurement. Real time
output control. Serial baud rate timer
Timer
3
..................Square-wave output. Event count. Serial baud rate timer
Timer
6
..................8-bit freerun timer. Time base timer
Timer A, B, C, D, E
Timer
0, 1
can be cascade-connected
Timer
0, 1, 2
can be cascade-connected
Timer
2, 3
can be cascade-connected
Timer
0, 1, 2, 3
can be cascade-connected
16-bit
timer
×
1
Timer
7
..................Square-wave/16-bit PWM output (cycle/duty continuous variable). Event count. Synchronous output event. Pulse
width measurement. Input capture
Time base timer: One-minute count setting
Watchdog timer
×
1
Serial interface
Synchronous type/UART (full-duplex)
×
3:
Serial
0, 1, 4
Synchronous type/Single-master I
2
C
×
1:
Serial
2
Synchronous type/I
2
C
×
1:
Serial
3
DMA controller
Number of channels:
2
channels
Maximum transfer cycles:
255
Starting factor: External request. Various types of interrupt. Software
Transfer mode:
1-byte
transfer. Word transfer. Burst transfer
I/O Pins
I/O
22
:
(5 V I/F port) Common use. Specified pull-up resistor available. Input/output selectable (bit unit)
62
:
(3 V I/F port) Common use. Specified pull-up resistor available. Input/output selectable (bit unit)
1
:
(3 V I/F port) Common use
A/D converter
10-bit
×
8
channels (with S/H)
Special Ports
Buzzer output. High-current drive port
ROM Correction
Correcting address designation: Up to
7
addresses possible
MAD00046LEM
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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