MN101E35 Series
Type
Internal ROM type
ROM (byte)
RAM (byte)
Package (Lead-free)
Minimum Instruction
Execution Time
TQFP048-P-0707B
32K
MN101E35A
MN101E35D
68K
4K
HQFP048-P-0707B,
TQFP048-P-0707B
0.042
µs (at
2.2
V to
3.6
V,
24
MHz, When USB unused)
0.0625
µs (at
3.0
V to
3.6
V,
16
MHz, When USB used)
62.5
µs (at
2.2
V to
3.6
V,
32
kHz)
MN101EF35A
32K
MN101EF35D
FLASH
64K+4K
128K+4K
8K
HQFP048-P-0707B
MN101EF35G
Mask ROM
Interrupts
RESET. Watchdog. External
0
to
4.
External
5
(key interrupt dedicated). External
6.
Timer
0
to
4.
Timer
6.
Timer
7
(2 systems). Timer
8
(2 systems). Timer
9
(2 systems). Time base. Serial
1
(2 systems). Serial
2
(2 systems). Serial
4
(2 systems). A/D conversion finish. USB
interrupts
Timer Counter
8-bit
timer
×
6
Timer
0
..................Square-wave output. PWM output. Event count. Simple pulse width measurement. Square-wave/PWM output to
large current terminal P03 (TM0IOB) possible
Timer
1
..................Square-wave output. Event count
Timer
2
..................Square-wave output. PWM output. Event count. Simple pulse width measurement. Square-wave/PWM output to
large current terminal P03 (TM2IOB) possible
Timer
3
..................Square-wave output. Event count
Timer
4
..................Square-wave output. PWM output. Event count. Simple pulse width measurement. Square-wave/PWM output to
large current terminal P02 (TM4IOC) possible
Timer
6
..................8-bit freerun timer
Timer
0, 1
can be cascade-connected
Timer
2, 3
can be cascade-connected
Timer
0, 1, 2
can be cascade-connected
Timer
0, 1, 2, 3
can be cascade-connected
16-bit
timer
×
3
Timer
7
..................Square-wave output. PWM output (cycle/duty continuous variable). Event count. Pulse width measurement. Input
capture. Square-wave/PWM output to large current terminal P00 (TM7IOB) possible
Timer
8
..................Square-wave output. PWM output (cycle/duty continuous variable). Event count. Pulse width measurement. Input
capture. Square-wave/PWM output to large current terminal P01 (TM8IOB) possible
Timer
9
..................Square-wave output. PWM output (cycle/duty continuous variable). Event count. Pulse width measurement. Input
capture
Time base timer: One-minute count setting
Watchdog timer
×
1
Serial interface
Synchronous type/UART (full-duplex)
×
2:
Serial
1, 2
Synchronous type/Multi-master I
2
C
×
1:
Serial
4
Serial
4
...................7-bit/10-bit address setting. General call
USB Functions
Conforms to USB
2.0:
Full-speed (12 Mbps) supported
USB transceiver built-in.
3
end points (FIFO built-in independently)
FIFO size: EP0 =
16
bytes. EP1 =
128
bytes. EP2 =
128
bytes
EP0: Control transfer. IN/OUT (two ways)
EP1 to EP2: Interrupt/Bulk/Isochronous transfer supported. Settable to IN or OUT. Double Buffering function supported
When the MAXP size is set to a half or less of the MAXFIFO size for each EP, the Double Buffering function is made valid
automatically
I/O Pins
I/O
37
:
Common use. Specified pull-up resistor available. Input/output selectable (bit unit)
A/D converter
10-bit
×
8
channels (with S/H)
MAD00061HEM
MN101E35A, MN101E35D, MN101EF35A, MN101EF35D, MN101EF35G
Extended Calculation
16-bit
×
16-bit
multiplication.
32-bit
/
16-bit
division
Special Ports
USB ports (D+, D–). Buzzer output. Remote control carrier output. High-current drive port. Clock output
ROM Correction
Correcting address designation: Up to
7
addresses possible
Pin Assignment
HQFP048-P-0707B, TQFP048-P-0707B
P71, SBI2A, RXD2A
P70, SBO2A, TXD2A
P67, SBT4, SCL4
P66, SBO4, SDA4
P65, SBI4
P64, TM4IOB
P63, TM3IOB
P50, KEY0, TM1IOB
P51, KEY1, TM9IOB
P52, KEY2, SBT2B
P53, BUZZER, KEY3, SBI2B, RXD2B
P54, NBUZZER, KEY4, SBO2B, TXD2B
P72, SBT2A
P75
D-
D+
PA0, AN0, TM0IOA, RMOUTA
PA1, AN1, TM1IOA
PA2, AN2, TM2IOA
PA3, AN3, TM3IOA
PA4, AN4, TM4IOA
PA5, AN5, TM7IOA
PA6, AN6, TM8IOA
PA7, AN7, TM9IOA
37
38
39
40
41
42
43
44
45
46
47
48
1
2
3
4
5
6
7
8
9
10
11
12
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
CLKOUT, KEY5, P55
KEY6, P56
KEY7, P57
RMOUTC, TM0IOC, IRQ6, P10
IRQ4, P24
IRQ3, P23
IRQ2, P22
IRQ1, P21
IRQ0, P20
RMOUTB, TM2IOB, TM0IOB, LED3, P03
SBT1, TM4IOC, LED2, P02
TXD1, SBO1, TM8IOB, LED1, P01
MAD00061HEM
Vref+
MMOD
NRST, P27
XO, P91
XI, P90
VSS
OSC1
OSC2
VDD33
VOUT18
DMOD
RXD1, SBI1, TM7IOB, LED0, P00
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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