MN101E29 Series
Type
Internal ROM type
ROM (byte)
RAM (byte)
Package (Lead-free)
Minimum Instruction
Execution Time
MN101E29G
Mask ROM
128K
6K
LQFP100-P-1414, QFP100-P-1818B
50
ns (at
2.2
V to
5.5
V,
20
MHz)
*: at internal
2
,
3
,
4
,
5
,
6
,
8
,
10
times oscillation used
MN101EF29G
FLASH
128K+4K
Interrupts
6
external interrupts.
28
internal interrupts
RESET. NMI. External
0
to
4.
Timer
0
to
4.
Timer
6.
Timer
7
(2 systems). Timer
8
(2 systems). Timer
9
(2 systems). Time base. Serial
0
(2 systems). Serial
1
(2 systems). Serial
2
(2 systems). Serial
3
(2 systems). Serial
4.
Serial
5.
A/D conversion. Automatic transfer (2
systems). Key interrupt
Timer Counter
8-bit
timer
×
7
Timer
0
..................Timer pulse output. Event count. Added pulse (2-bit) type PWM output. Remote control carrier output. Simple
pulse width measurement. Real time output control
Timer
1
..................Timer pulse output. Event count.
16-bit
cascade connected (timer
0, 1).
Timer synchronous output
Timer
2
..................Timer pulse output. Event count. Added pulse (2-bit) type PWM output. Simple pulse width measurement.
24-bit
cascade connected (timer
0, 1, 2).
Timer synchronous output. Real time output control
Timer
3
..................Timer pulse output. Event count. Remote control carrier output.
16-bit
cascade connected (timer
2, 3). 32-bit
cascade connected (timer
0, 1, 2, 3)
Timer
4
..................Timer pulse output. Added pulse (2-bit) type PWM output. Event count. Serial transfer clock output. Simple pulse
width measurement
Timer
6
..................8-bit freerun timer. Time base timer
Timer A..................Event count. Baud rate timer. Clock output for peripheral function
16-bit
timer
×
3
Timer
7
..................Timer pulse output. Event count. High accuracy PWM. High performance IGBT output (cycle/duty continuous
variable). Timer synchronous output. Input capture (both edge available). Real time output control. Double buffer
compare register
Timer
8
..................Timer pulse output. Event count. High accuracy PWM output (cycle/duty continuous variable). Pulse width
measurement. Input capture (both edge available).
32-bit
cascade connected (timer
7, 8). 32-bit
PWM output.
Synchronous output event. Double buffer compare register
Timer
9
..................Timer pulse output. Event count. High accuracy PWM output (cycle/duty continuous variable). Pulse width
measurement. Input capture (both edge available). Real time output control. Double buffer compare register
Watchdog timer
×
1
Serial interface
Synchronous type/UART (full-duplex)
×
4:
Serial
0
to
3
Synchronous type/Multi-master I
2
C
×
1:
Serial
4
I
2
C slave
×
1:
Serial
5
DMA controller
2
systems. Maximum transfer cycles are
255
Starting factor: External request. Internal event. Software
I/O Pins
I/O
90
:
Common use. Specified pull-up/pull-down resistor available. Input/output selectable (bit unit)
A/D converter
10-bit
×
16
channels
D/A converter
8-bit
×
4
channels
Display control function
LCD:
55
segments
×
4
commons (Static,
1/2, 1/3,
or
1/4
duty)
1/3
bias
Usable if VLC1
≤
VDD
MAD00062FEM
MN101E29G, MN101EF29G
Special Ports
Buzzer output. Inverted buzzer output. Remote control carrier output. High-current drive port
ROM Correction
Correcting address designation: Up to
7
addresses possible
Pin Assignment
LQFP100-P-1414, QFP100-P-1818B
P72, SBT2A, NWE, SEG9
P71, SBI2A, RXD2A, A7, SEG10
P70, SBO2A, TXD2A, A6, SEG11
P67, SBT4A, SCL4A, A5, SEG12
P66, SBO4A, SDA4A, A4, SEG13
P65, SBI4A, A3, SEG14
P64, TM4IOB, A2, SEG15
P63, TM3IOB, A1, SEG16
P62, TM1IOB, A0, SEG17
P61, DA_B, SEG18
P60, SEG19
P50, SBO0A, TXD0A, KEY0, D0, SEG20
P51, SBI0A, RXD0A, KEY1, D1, SEG21
P52, SBT0A, KEY2, D2, SEG22
P53, BUZZERA, KEY3, D3, SEG23
P54, NBUZZERA, KEY4, D4, SEG24
P55, KEY5, D5, SEG25
P56, KEY6, D6, SEG26
P57, KEY7, D7, SEG27
P47, SCL5B, SEG28
P46, SDA5B, SEG29
P45, SBT0B, SEG30
P44, SBI0B, RXD0B, SEG31
P43, SBO0B, TXD0B, SEG32
P42, SBT3B, SEG33
SDA5A, NRE, SEG8, P73
SCL5A, NCS, SEG7, P74
SBO1B, TXD1B, A8, SEG6, P75
SBI1B, RXD1B, A9, SEG5, P76
SBT1B, A10, SEG4, P77
TM9OD0, SDO0, A11, SEG3, P80
TM9OD1, SDO1, A12, SEG2, P81
TM9OD2, SDO2, A13, SEG1, P82
TM9OD3, SDO3, A14, SEG0, P83
TM9OD4, SDO4, A15, COM0, P84
TM9OD5, SDO5, A16, COM1, P85
SDO6, A17, COM2, P86
SDO7, A18, COM3, P87
A19, VLC3, P92
NDK, VLC2, P93
DA_C, VLC1, P94
DA_D, P95
AN15, PB7
AN14, PB6
AN13, PB5
AN12, PB4
AN11, PB3
AN10, PB2
AN9, PB1
AN8, PB0
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
P41, SBI3B, RXD3B, SEG34
P40, SBO3B, TXD3B, SEG35
P36, SEG36
P35, SBI4B, SEG37
P34, SBT4B, SCL4B, SEG38
P33, SBO4B, SDA4B, SEG39
P32, SBT2B, SEG40
P31, SBI2B, RXD2B, SEG41
P30, SBO2B, TXD2B, SEG42
P16, TM8IOC, NBUZZERB, SEG43
P15, TM7IOC, BUZZERB, SEG44
P14, TM4IOC, SEG45
P13, TM3IOC, SEG46
P12, TM1IOC, SEG47
P11, TM2IOC, SEG48
P10, TM0IOC, RMOUTC, SEG49
P24, IRQ4, SEG50
P23, IRQ3, SEG51
P22, IRQ2, SEG52
P21, IRQ1, ACZ1, SEG53
P20, IRQ0, ACZ0, SEG54
P07, LED7, DA_A
P06, LED6, SBT3A
P05, LED5, SBI3A, RXD3A
P04, LED4, SBO3A, TXD3A
MAD00062FEM
AN0, TM0IOA, RMOUTA, PA0
AN1, TM1IOA, PA1
AN2, TM2IOA, PA2
AN3, TM3IOA, PA3
AN4, TM4IOA, PA4
AN5, TM7IOA, PA5
AN6, TM8IOA, PA6
AN7, TM9IOA, PA7
VREF+
MMOD
ATRST
NRST, P27
XO, P91
XI, P90
VSS
OSC1
OSC2
VDD5
VDD18
P96
DMOD
LED0, TM7IOB, SBI1A, RXD1A, P00
LED1, TM8IOB, SBO1A, TXD1A, P01
LED2, TM9IOB, SBT1A, P02
LED3, TM0IOB, TM2IOB, RMOUTB, P03
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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