Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPA90R500C3
MA000468296
PG-TO220-3-111
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
9.945
1.120
0.336
1118.332
2.650
2.193
206.181
888.335
7.942
0.305
0.001
0.461
1.152
2.995
Average
Mass
[%]
0.44
0.05
0.02
49.89
0.12
0.10
9.20
39.62
0.35
0.01
0.00
0.02
0.05
0.13
29. August 2013
2241.95 mg
Sum
[%]
0.44
Average
Mass
[ppm]
4436
499
150
49.96
0.12
498822
1182
978
91965
48.92
0.35
396234
3542
136
0.01
0
206
514
0.20
1336
2056
1000000
136
489177
3542
499471
1182
Sum
[ppm]
4436
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
微控制器 MCU
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