SAMPLE AND HOLD AMPLIFIER, 5 us ACQUISITION TIME, PDIP8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Burr-Brown |
| Objectid | 1451092771 |
| 包装说明 | DIP, DIP8,.3 |
| Reach Compliance Code | unknow |
| compound_id | 293756514 |
| 最长采集时间 | 12 µs |
| 标称采集时间 | 5 µs |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT |
| 最大下降率 | 0.2 V/s |
| JESD-30 代码 | R-PDIP-T8 |
| JESD-609代码 | e0 |
| 负供电电压上限 | -18 V |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 采样并保持/跟踪并保持 | SAMPLE |
| 最大压摆率 | 6.5 mA |
| 供电电压上限 | 18 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| SHC298JP | SHC298JU | SHC298AM | SHC298 | SHC298AJP | |
|---|---|---|---|---|---|
| 描述 | SAMPLE AND HOLD AMPLIFIER, 5 us ACQUISITION TIME, PDIP8 | SAMPLE AND HOLD AMPLIFIER, 5 us ACQUISITION TIME, PDSO8 | SAMPLE AND HOLD AMPLIFIER, 5 us ACQUISITION TIME, MBCY8 | SAMPLE AND HOLD AMPLIFIER, 5 us ACQUISITION TIME, PDSO8 | SAMPLE AND HOLD AMPLIFIER, 4 us ACQUISITION TIME, PDIP8 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | Burr-Brown | Burr-Brown | Burr-Brown | - | Burr-Brown |
| Reach Compliance Code | unknow | unknow | unknow | - | unknow |
| 最长采集时间 | 12 µs | 12 µs | 12 µs | - | 6 µs |
| 标称采集时间 | 5 µs | 5 µs | 5 µs | - | 4 µs |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | - | SAMPLE AND HOLD CIRCUIT |
| 最大下降率 | 0.2 V/s | 0.2 V/s | 0.2 V/s | - | 0.1 V/s |
| JESD-30 代码 | R-PDIP-T8 | R-PDSO-G8 | O-MBCY-W8 | - | R-PDIP-T8 |
| JESD-609代码 | e0 | e0 | e0 | - | e0 |
| 负供电电压上限 | -18 V | -18 V | -18 V | - | -18 V |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | - | -15 V |
| 功能数量 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 8 | 8 | 8 | - | 8 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | - | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | METAL | - | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | - | - | DIP |
| 封装等效代码 | DIP8,.3 | SOP8,.25 | CAN8,.2 | - | DIP8,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | ROUND | - | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | CYLINDRICAL | - | IN-LINE |
| 电源 | +-15 V | +-15 V | +-15 V | - | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | - | SAMPLE |
| 最大压摆率 | 6.5 mA | 6.5 mA | 6.5 mA | - | 6.5 mA |
| 供电电压上限 | 18 V | 18 V | 18 V | - | 18 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | - | 15 V |
| 表面贴装 | NO | YES | NO | - | NO |
| 温度等级 | COMMERCIAL | COMMERCIAL | OTHER | - | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | WIRE | - | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | - | - | 2.54 mm |
| 端子位置 | DUAL | DUAL | BOTTOM | - | DUAL |
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