High-Speed Fully Differential Amplifier, +/-5 V 8-MSOP-PowerPAD -40 to 85
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | MSOP |
包装说明 | HTSSOP, TSSOP8,.19 |
针数 | 8 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 6 weeks |
放大器类型 | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) | 4.6 µA |
标称带宽 (3dB) | 30 MHz |
25C 时的最大偏置电流 (IIB) | 4.6 µA |
最小共模抑制比 | 74 dB |
标称共模抑制比 | 80 dB |
频率补偿 | YES |
最大输入失调电流 (IIO) | 1 µA |
最大输入失调电压 | 7000 µV |
JESD-30 代码 | S-PDSO-G8 |
JESD-609代码 | e4 |
长度 | 3 mm |
低-偏置 | NO |
低-失调 | NO |
微功率 | NO |
湿度敏感等级 | 1 |
负供电电压上限 | -8.25 V |
标称负供电电压 (Vsup) | -5 V |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HTSSOP |
封装等效代码 | TSSOP8,.19 |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
包装方法 | TUBE |
峰值回流温度(摄氏度) | 260 |
功率 | NO |
电源 | 5/+-5 V |
可编程功率 | NO |
认证状态 | Not Qualified |
座面最大高度 | 1.07 mm |
标称压摆率 | 2800 V/us |
最大压摆率 | 28 mA |
供电电压上限 | 8.25 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
标称均一增益带宽 | 300000 kHz |
最小电压增益 | 355 |
宽带 | YES |
宽度 | 3 mm |
器件名 | 厂商 | 描述 |
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