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5-MCB-32D8-D

产品描述Fixed Resistor, Thin Film, 0.25W, 32.8ohm, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 1010, CHIP
产品类别无源元件    电阻器   
文件大小1MB,共2页
制造商API Technologies
官网地址http://www.apitech.com/about-api
下载文档 详细参数 全文预览

5-MCB-32D8-D概述

Fixed Resistor, Thin Film, 0.25W, 32.8ohm, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 1010, CHIP

5-MCB-32D8-D规格参数

参数名称属性值
Objectid4000889786
包装说明CHIP
Reach Compliance Codecompliant
ECCN代码EAR99
JESD-609代码e4
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
封装形状RECTANGULAR PACKAGE
额定功率耗散 (P)0.25 W
额定温度70 °C
电阻32.8 Ω
电阻器类型FIXED RESISTOR
尺寸代码1010
表面贴装YES
技术THIN FILM
温度系数50 ppm/°C
端子面层GOLD
端子形状ONE SURFACE
容差0.5%

5-MCB-32D8-D文档预览

M
ICROWAVE
C
HIP
R
ESISTORS
Thin Film on Ceramic
F
EATURES
• Low VSWR: < 1.2 at 8 GHz
• Low TCR 0 to -50 ppm
:
• Four Sizes:
0.020 X 0.040 to 0.100 X 0.100 inches
• Wire Bond / Solder Mount Option
Spectrum Microwave
Chip Resistors are produced with
state-of-the-art thin film sputtering techniques on microwave
grade alumina. The advantages of sputtered over evaporated
metal films include better adhesion to the substrate, increased
reliability, and more uniform composition, density, and
thickness. Their T
CR
, noise level, and stability are similar to
discrete metal film resistors. The small size and careful
design of Spectrum Microwave Chip Resistors result in low
VSWR and low parasitics. They are available with gold pads
for wire bonding or solder bumps for surface mounting.
MCB/MCG (B
ARE
B
ACK
/G
OLD
B
ACK
)
The MCB and MCG resistors have gold terminations for wirebonds,
although epoxy may also be used. MCB resistors have no backside
metallization. They are die-mounted with epoxy. MCG resistors have
a gold backside metallization. The metallization is electronically
isolated from the front terminations.
.003
TYP.
.010 MIN.
.003 TYP.
T = .010
±
.001
L
±
.005
W
±
.005
T = .020 MAX.
.010 MIN.
.003 TYP.
0.003 TYP.
MCS (S
OLDER
B
UMP
)
MCS resistors have solder bump terminations for flip-chip surface
mounting. They have no backside metallizing. They can also be
die-mounted with epoxy with solder bumps exposed for connection.
O
RDERING
I
NSTRUCTIONS
Construct Part Number From Choices:
___________ - _____________________- ___________
_-
(size)
(type)
(ohms)*
(tolerance)
2
MCB
D = 0.5%
3
MCG
F = 1%
4
MCS
J = 5%
5
K = 10%
W
±
.005
L
±
.005
Example: 2-MCS-1001-J
(Example is a 0.020-by-0.040-inch chip with solder-bump
terminations, 1000 ohms ±5% resistance.)
*First 3 digits are significant figures. Fourth is number of zeros to follow or D for decimal between second and third digits.
Tel: 508-485-6350 Fax: 508-485-5168
165 Cedar Hill Street, Marlborough, Ma 01752
www.SpectrumMicrowave.com
Spectrum Microwave
M
ICROWAVE
C
HIP
R
ESISTORS
Thin Film on Ceramic
S
PECIFICATIONS
Substrate:
Material . . . . . . . . . . . . . . . . . . . . . . . .99.6% Al
2
O
3
Thickness . . . . . . . . . . . . . . . . . . .0.010 ± 0.001 in.
Conductor Film Thickness:
MCB
Nichrome . . . . . . . . . . . . .As required for resistivity
Titungsten . . . . . . . . . . . . . . . . . . . . . . .700Å min.
Gold . . . . . . . . . . . . . . . . . . . . . . . . . .100µ in. min.
MCG
Front . . . . . . . . . . . . . . . . . . . . . . . . .same as MCB
Back
Titungsten . . . . . . . . . . . . . . . . . . .250 ± 100Å
Gold . . . . . . . . . . . . . . . . . . . . . .100µ in. min.
MCS
Nichrome . . . . . . . . . . . . .As required for resistivity
Titungsten . . . . . . . . . . . . . . . . . . . .700Å min.
Gold . . . . . . . . . . . . . . . . . . . . . . . .7µ in. min.
Nickel . . . . . . . . . . . . . . . . . . . . . .10µ in. min.
Gold . . . . . . . . . . . . . . . . . . . . . . .30µ in. min.
Solder (60/40) . . . . . . . . . . . . . .1 to 3 mils typ
T
YPICAL
E
LECTRICAL
D
ATA
T
CR
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .0 to -50 ppm
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°
to +150°C
Noise: . . . . . . . . . . . . . . . . . . . . . . . . . . . .< 0.1 mV/V
VSWR . . . . . . . . . . . . . . . . . . . . . . . . .< 1.2 to 8 GHz
VSWR . . . . . . . . . . . . . . . . . . . . . .
1.48 to 18 GHZ
<
Dielectric k . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9.9
Dissipation Factor . . . . . . . . . . . . . . . . . . . . . . .0.001
Loss Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.0001
Specifications subject to change without notice.
S
IZES
/ P
OWER
/ R
ESISTANCE
R
ANGE
Dimensions
(Inches)
Size 2:
0.020 X 0.040
Size 3:
0.050 X 0.050
Size 4:
0.50 X 0.100
Size 5:
0.100 X 0.100
Power*
(mW)
75
100
150
250
Range
(ohms)
10 to 3000
10 to 1500
10 to 1500
10 to 1500
*Maximum continuous rating at 70°C when bonded to substrate.
Derate to zero at 150°C.
Spectrum Microwave
also manufactures Custom Substrates on a variety of materials, a wide range of Microwave, PIN
Diode Drivers, and Custom Hybrid Circuits. Please contact the factory or your local representative for more information.

 
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