TMP95C061B
Document Change Notification
The purpose of this notification is to inform customers about the launch of the Pb-free version of the
device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this
notification is intended as a substitute for a revision of the datasheet.
Changes to the datasheet may include the following, though not all of them may apply to this
particular device.
1. Part number
Example: TMPxxxxxxF
→
TMPxxxxxxFG
All references to the previous part number were left unchanged in body text. The new
part number is indicated on the prelims pages (cover page and this notification).
2. Package code and package dimensions
Example: LQFP100-P-1414-0.50C
→
LQFP100-P-1414-0.50F
All references to the previous package code and package dimensions were left unchanged
in body text. The new ones are indicated on the prelims pages.
3. Addition of notes on lead solderability
Now that the device is Pb-free, notes on lead solderability have been added.
4. RESTRICTIONS ON PRODUCT USE
The previous (obsolete) provision might be left unchanged on page 1 of body text. A new
replacement is included on the next page.
5. Publication date of the datasheet
The publication date at the lower right corner of the prelims pages applies to the new
device.
I
2011-01-26
TMP95C061B
1. Part number
2. Package code and dimensions
Previous Part Number Previous Package Code
New Part Number
(in Body Text)
(in Body Text)
TMP95C061BF
−
(Note)
New Package Code
QFP100-P-1414-0.50
LQFP100-P-1414-0.50F
P-QFP100-1414-0.50
−
(Note)
TMP95C061BFG
TMP95C061BDFG
Note: Pb-containing variant not available.
*
: For the dimensions of the new package, see the attached Package Dimensions diagram.
3. Addition of notes on lead solderability
The following solderability test is conducted on the new device.
Solderability
Test Parameter
Test Condition
Use of Sn-37Pb solder Bath
Solder bath temperature
=
230°C, Dipping time
=
5 seconds
The number of times
=
one, Use of R-type flux
Use of Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature
=
245°C, Dipping time
=
5 seconds
The number of times
=
one, Use of R-type flux
Note
Solderability
Pass:
Solderability rate until forming
≥
95%
4. RESTRICTIONS ON PRODUCT USE
It replaces the “RESTRICTIONS ON PRODUCT USE” on page 1 of body text. For details, see
the attached RESTRICTIONS ON PRODUCT USE.
5. Publication date of the datasheet
The publication date of this datasheet is printed at the lower right corner of this notification.
II
2011-01-26
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