8-Ch. 10-Bit 1.25 MSPS ADC 8-Ch., DSP/SPI, Hardware Configurable, Low Power 32-TSSOP 0 to 70
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | TSSOP |
包装说明 | GREEN, PLASTIC, TSSOP-32 |
针数 | 32 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 1 week |
Is Samacsys | N |
最大模拟输入电压 | 5.5 V |
最小模拟输入电压 | |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDSO-G32 |
JESD-609代码 | e4 |
长度 | 11 mm |
最大线性误差 (EL) | 0.0977% |
湿度敏感等级 | 2 |
模拟输入通道数量 | 8 |
位数 | 10 |
功能数量 | 1 |
端子数量 | 32 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出位码 | BINARY, 2'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP32,.3 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 3/5 V |
认证状态 | Not Qualified |
采样速率 | 1.25 MHz |
座面最大高度 | 1.2 mm |
最大压摆率 | 8.5 mA |
最小供电电压 | 2.7 V |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 6.2 mm |
Base Number Matches | 1 |
TLV1578CDA | TLV1571CDW | TLV1571IDW | TLV1571IDWG4 | TLV1571IPW | TLV1578CDAG4 | TLV1578CDAR | TLV1578CDARG4 | TLV1578IDA | TLV1578IDAG4 | |
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描述 | 8-Ch. 10-Bit 1.25 MSPS ADC 8-Ch., DSP/SPI, Hardware Configurable, Low Power 32-TSSOP 0 to 70 | 1-Ch. 10-Bit 1.25 MSPS ADC 8-Ch., DSP/SPI, Hardware Configurable, Low Power 24-SOIC 0 to 70 | 1-Ch. 10-Bit 1.25 MSPS ADC 8-Ch., DSP/SPI, Hardware Configurable, Low Power 24-SOIC -40 to 85 | 1-Ch. 10-Bit 1.25 MSPS ADC 8-Ch., DSP/SPI, Hardware Configurable, Low Power 24-SOIC -40 to 85 | 1-Ch. 10-Bit 1.25 MSPS ADC 8-Ch., DSP/SPI, Hardware Configurable, Low Power 24-TSSOP -40 to 85 | 8-Ch. 10-Bit 1.25 MSPS ADC 8-Ch., DSP/SPI, Hardware Configurable, Low Power 32-TSSOP 0 to 70 | 8-Ch. 10-Bit 1.25 MSPS ADC 8-Ch., DSP/SPI, Hardware Configurable, Low Power 32-TSSOP 0 to 70 | 8-Ch. 10-Bit 1.25 MSPS ADC 8-Ch., DSP/SPI, Hardware Configurable, Low Power 32-TSSOP 0 to 70 | 8-Ch. 10-Bit 1.25 MSPS ADC 8-Ch., DSP/SPI, Hardware Configurable, Low Power 32-TSSOP -40 to 85 | 8-Ch. 10-Bit 1.25 MSPS ADC 8-Ch., DSP/SPI, Hardware Configurable, Low Power 32-TSSOP -40 to 85 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | TSSOP | SOIC | SOIC | SOIC | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
包装说明 | GREEN, PLASTIC, TSSOP-32 | SOP, SOP24,.4 | SOP, SOP24,.4 | SOP, SOP24,.4 | TSSOP, TSSOP24,.25 | TSSOP, TSSOP32,.3 | TSSOP, TSSOP32,.3 | TSSOP, TSSOP32,.3 | GREEN, PLASTIC, TSSOP-32 | TSSOP, TSSOP32,.3 |
针数 | 32 | 24 | 24 | 24 | 24 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | compliant | compli | compli | compli | compli | compli | compli | compli | compliant | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大模拟输入电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-PDSO-G32 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
长度 | 11 mm | 15.4 mm | 15.4 mm | 15.4 mm | 7.8 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm |
最大线性误差 (EL) | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% |
湿度敏感等级 | 2 | 1 | 1 | 1 | 2 | 2 | 2 | 2 | 2 | 2 |
模拟输入通道数量 | 8 | 1 | 1 | 1 | 1 | 8 | 8 | 8 | 8 | 8 |
位数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 24 | 24 | 24 | 24 | 32 | 32 | 32 | 32 | 32 |
最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C |
输出位码 | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2\'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY | BINARY, 2'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | SOP | SOP | SOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
封装等效代码 | TSSOP32,.3 | SOP24,.4 | SOP24,.4 | SOP24,.4 | TSSOP24,.25 | TSSOP32,.3 | TSSOP32,.3 | TSSOP32,.3 | TSSOP32,.3 | TSSOP32,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 1.25 MHz | 1.25 MHz | 1.25 MHz | 1.25 MHz | 0.625 MHz | 1.25 MHz | 1.25 MHz | 0.625 MHz | 1.25 MHz | 1.25 MHz |
座面最大高度 | 1.2 mm | 2.65 mm | 2.65 mm | 2.65 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 6.2 mm | 7.5 mm | 7.5 mm | 7.5 mm | 4.4 mm | 6.2 mm | 6.2 mm | 6.2 mm | 6.2 mm | 6.2 mm |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | - | 不含铅 | - | 不含铅 | 不含铅 |
Factory Lead Time | 1 week | 1 week | 1 week | 16 weeks | - | - | 1 week | - | 1 week | 6 weeks |
最大压摆率 | 8.5 mA | 8.5 mA | 8.5 mA | 8.5 mA | - | 8.5 mA | 8.5 mA | 8.5 mA | 8.5 mA | 8.5 mA |
最小供电电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - | - | 2.7 V | - | 2.7 V | 2.7 V |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - | 1 | 1 |
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