High speed CAN transceiver
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | unknow |
| 数据速率 | 1000 Mbps |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 4.9 mm |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 收发器数量 | 1 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大压摆率 | 0.07 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 电信集成电路类型 | INTERFACE CIRCUIT |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3.9 mm |
| TJA1040TD-T | TJA1040T/S950M,518 | TJA1040T/N,118 | TJA1040T/S965,518 | TJA1040T/N1M,518 | TJA1040T/N1M,118 | TJA1040T/N1M,112 | TJA1040 | TJA1040U | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | High speed CAN transceiver | DATACOM, INTERFACE CIRCUIT, PDSO8 | DATACOM, INTERFACE CIRCUIT, PDSO8 | DATACOM, INTERFACE CIRCUIT, PDSO8 | DATACOM, INTERFACE CIRCUIT, PDSO8 | DATACOM, INTERFACE CIRCUIT, PDSO8 | DATACOM, INTERFACE CIRCUIT, PDSO8 | High speed CAN transceiver | High speed CAN transceiver |
| Source Url Status Check Date | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | 2013-06-14 00:00:00 | - | - |
| 零件包装代码 | SOIC | SOIC | SOIC | - | SOIC | SOIC | SOIC | - | DIE |
| 包装说明 | SOP, SOP8,.25 | SOP, | SOP, SOP8,.25 | SOP, | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, | - | DIE, |
| 针数 | 8 | 8 | 8 | - | 8 | 8 | 8 | - | 8 |
| Reach Compliance Code | unknow | unknown | unknow | unknow | unknow | unknow | unknow | - | unknown |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | - | R-XUUC-N8 |
| 长度 | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | - | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | UNSPECIFIED |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | - | DIE |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | UNCASED CHIP |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | - | - | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | - | - |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | - | YES |
| 电信集成电路类型 | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | UPPER |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | - | - |
| Brand Name | - | NXP Semiconductor | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | NXP Semiconduc | - | - |
| 制造商包装代码 | - | SOT96-1 | SOT96-1 | - | SOT96-1 | SOT96-1 | SOT96-1 | - | - |
| Base Number Matches | - | - | 1 | 1 | 1 | 1 | 1 | - | - |
FPGA/CPLD
stm32/stm8
ADI参考电路
51单片机
模拟与混合信号
51单片机
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