
Quadruple Bilateral Analog Switch 14-PDIP -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| Samacsys Descripti | Texas Instruments SN74LV4066AN, Bilateral Switch Quad SPST Switch, 2 → 5.5 V, 14-Pin PDIP |
| 模拟集成电路 - 其他类型 | SPST |
| 标称带宽 | 50 MHz |
| 最大输入电压 | 5.5 V |
| 最小输入电压 | 2 V |
| JESD-30 代码 | R-PDIP-T14 |
| JESD-609代码 | e4 |
| 长度 | 19.3 mm |
| 正常位置 | NO |
| 信道数量 | 4 |
| 功能数量 | 4 |
| 端子数量 | 14 |
| 标称断态隔离度 | 40 dB |
| 通态电阻匹配规范 | 6 Ω |
| 最大通态电阻 (Ron) | 180 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 2.5/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.9 mm |
| 最大供电电流 (Isup) | 0.035 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 2.3 V |
| 表面贴装 | NO |
| 最长断开时间 | 25 ns |
| 最长接通时间 | 25 ns |
| 切换 | MAKE-BEFORE-BREAK |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6.35 mm |
| Base Number Matches | 1 |
| SN74LV4066AN | SN74LV4066AD | SN74LV4066ADGVR | SN74LV4066ADR | SN74LV4066ANSR | SN74LV4066APW | SN74LV4066APWR | SN74LV4066APWT | SN74LV4066ARGYR | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Quadruple Bilateral Analog Switch 14-PDIP -40 to 85 | Quadruple Bilateral Analog Switch 14-SOIC -40 to 85 | Quadruple Bilateral Analog Switch 14-TVSOP -40 to 85 | Quadruple Bilateral Analog Switch 14-SOIC -40 to 85 | Quadruple Bilateral Analog Switch 14-SO -40 to 85 | Quadruple Bilateral Analog Switch 14-TSSOP -40 to 85 | Quadruple Bilateral Analog Switch 14-TSSOP -40 to 85 | Quadruple Bilateral Analog Switch 14-TSSOP -40 to 85 | Quadruple Bilateral Analog Switch 14-VQFN -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DIP | SOIC | SOIC | SOIC | SOIC | TSSOP | TSSOP | TSSOP | QFN |
| 包装说明 | DIP, DIP14,.3 | SOP, SOP14,.25 | TSSOP, TSSOP14,.25,16 | SOP, SOP14,.25 | SOP, SOP14,.3 | TSSOP, TSSOP14,.25 | TSSOP, TSSOP14,.25 | TSSOP, TSSOP14,.25 | HVQCCN, LCC14/18,.14SQ,20 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | compli |
| Factory Lead Time | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week | 1 week |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
| 标称带宽 | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| 最大输入电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小输入电压 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| JESD-30 代码 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | S-PQCC-N14 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 19.3 mm | 8.65 mm | 3.6 mm | 8.65 mm | 10.3 mm | 5 mm | 5 mm | 5 mm | 3.5 mm |
| 正常位置 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 信道数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 标称断态隔离度 | 40 dB | 40 dB | 40 dB | 40 dB | 40 dB | 40 dB | 40 dB | 40 dB | 40 dB |
| 通态电阻匹配规范 | 6 Ω | 6 Ω | 6 Ω | 6 Ω | 6 Ω | 6 Ω | 6 Ω | 6 Ω | 6 Ω |
| 最大通态电阻 (Ron) | 180 Ω | 180 Ω | 180 Ω | 180 Ω | 180 Ω | 180 Ω | 180 Ω | 180 Ω | 180 Ω |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | TSSOP | SOP | SOP | TSSOP | TSSOP | TSSOP | HVQCCN |
| 封装等效代码 | DIP14,.3 | SOP14,.25 | TSSOP14,.25,16 | SOP14,.25 | SOP14,.3 | TSSOP14,.25 | TSSOP14,.25 | TSSOP14,.25 | LCC14/18,.14SQ,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2/5.5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.9 mm | 1.58 mm | 1.05 mm | 1.58 mm | 1.95 mm | 1 mm | 1 mm | 1 mm | 0.9 mm |
| 最大供电电流 (Isup) | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 表面贴装 | NO | YES | YES | YES | YES | YES | YES | YES | YES |
| 最长断开时间 | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| 最长接通时间 | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| 切换 | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK | MAKE-BEFORE-BREAK |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 0.4 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 6.35 mm | 3.91 mm | 4.4 mm | 3.91 mm | 5.3 mm | 4.4 mm | 4.4 mm | 4.4 mm | 3.5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | - | EAR99 |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 2 |
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