Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IDW50E60
MA000958040
PG-TO247-3-44
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
tin
antimony
silver
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-31-5
7440-36-0
7440-22-4
Issued
Weight*
Weight
[mg]
2.125
3.972
1.192
3967.074
11.964
20.035
380.663
1602.793
31.874
1.226
0.189
0.472
Average
Mass
[%]
0.04
0.07
0.02
65.85
0.20
0.33
6.32
26.61
0.53
0.02
0.00
0.01
29. August 2013
6023.58 mg
Sum
[%]
0.04
Average
Mass
[ppm]
353
659
198
65.94
0.20
658591
1986
3326
63196
33.26
0.53
0.03
266086
5292
204
31
78
1000000
332608
5292
313
659448
1986
Sum
[ppm]
353
wire
encapsulation
leadfinish
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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