Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
KP254
MA000948400
PG-DSOF-8-16
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
silicone resin
epoxy resin
silicondioxide
gold
nickel
phosphorus
palladium
chromiumoxide
zincoxide
alumina
titandioxide
silicondioxide
silicone resin
glass fibre
Polyphenylene Sulfide
carbon black
silicondioxide
epoxy resin
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
-
60676-86-0
7440-57-5
7440-02-0
7723-14-0
7440-05-3
1308-38-9
1314-13-2
1344-28-1
13463-67-7
60676-86-0
-
-
26125-40-6
1333-86-4
60676-86-0
-
Issued
Weight*
Weight
[mg]
9.453
0.009
0.037
0.740
30.034
0.174
0.588
17.373
21.305
125.036
0.020
0.196
0.000
0.020
0.170
0.397
0.118
0.022
0.399
1.616
5.716
8.574
0.005
0.476
0.500
Average
Mass
[%]
4.24
0.00
0.02
0.33
13.47
0.08
0.26
7.79
9.55
56.09
0.01
0.09
0.00
0.01
0.08
0.18
0.05
0.01
0.18
0.72
2.56
3.85
0.00
0.21
0.22
29. August 2013
222.98 mg
Sum
[%]
4.24
Average
Mass
[ppm]
42393
41
166
3317
13.82
0.08
134694
780
2636
77915
95546
73.69
560757
89
879
2
0.11
90
764
0.26
1782
531
97
1787
0.96
7246
25635
6.41
38453
22
2134
0.43
2244
4400
1000000
64088
9661
2546
1060
736854
138218
780
Sum
[ppm]
42393
wire
encapsulation
noble metal
organic material
plastics
plastics
inorganic material
noble metal
non noble metal
inorganic material
noble metal
inorganic material
inorganic material
inorganic material
inorganic material
inorganic material
plastics
inorganic material
plastics
organic material
inorganic material
plastics
< 10%
leadfinish
plating
glue
lid
lid attach material
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
