Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IDV30E60C
MA000906956
PG-TO220-2-22
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
1.205
1.053
0.316
1051.163
2.467
2.224
209.078
900.816
5.465
1.114
0.003
0.112
0.279
0.726
Average
Mass
[%]
0.06
0.05
0.01
48.31
0.11
0.10
9.61
41.40
0.25
0.05
0.00
0.01
0.01
0.03
29. August 2013
2176.02 mg
Sum
[%]
0.06
Average
Mass
[ppm]
554
484
145
48.37
0.11
483067
1134
1022
96083
51.11
0.25
413974
2512
512
0.05
1
51
128
0.05
333
512
1000000
513
511079
2512
483696
1134
Sum
[ppm]
554
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
微控制器 MCU
京公网安备 11010802033920号
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