Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IDP04E120
MA000693846
PG-TO220-2-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
0.905
0.753
0.226
751.797
0.634
6.034
114.655
482.758
14.487
0.198
0.000
0.070
0.175
0.455
0.177
0.590
589.466
Average
Mass
[%]
0.05
0.04
0.01
38.29
0.03
0.31
5.84
24.59
0.74
0.01
0.00
0.00
0.01
0.02
0.01
0.03
30.02
29. August 2013
1963.38 mg
Sum
[%]
0.05
Average
Mass
[ppm]
461
383
115
38.34
0.03
382908
323
3074
58397
30.74
0.74
245881
7378
101
0.01
1
36
89
0.03
232
90
301
30.06
300230
300621
1000000
357
101
307352
7378
383407
323
Sum
[ppm]
461
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com