Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SGW30N60
MA000669588
PG-TO247-3-41
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
tin
silver
antimony
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-31-5
7440-22-4
7440-36-0
Issued
Weight*
Weight
[mg]
5.987
3.972
1.192
3967.071
4.224
20.010
380.194
1600.816
31.874
28.550
1.003
0.386
0.154
Average
Mass
[%]
0.10
0.07
0.02
65.61
0.07
0.33
6.29
26.48
0.53
0.47
0.02
0.01
0.00
29. August 2013
6045.38 mg
Sum
[%]
0.10
Average
Mass
[ppm]
990
657
197
65.70
0.07
656209
699
3310
62889
33.10
0.53
0.47
264798
5272
4723
166
64
0.03
26
255
1000000
330997
5272
4723
657064
699
Sum
[ppm]
990
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com