Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IDH10S120
MA000622910
PG-TO220-2-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
siliconcarbide
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
409-21-2
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
6.929
1.343
0.403
1341.263
1.289
9.020
99.215
493.070
14.487
0.198
0.000
0.209
0.167
7.988
Average
Mass
[%]
0.35
0.07
0.02
67.89
0.07
0.46
5.02
24.96
0.73
0.01
0.00
0.01
0.01
0.40
29. August 2013
1975.58 mg
Sum
[%]
0.35
Average
Mass
[ppm]
3507
680
204
67.98
0.07
678920
653
4566
50221
30.44
0.73
249582
7333
100
0.01
0
106
85
0.42
4043
4234
1000000
100
304369
7333
679804
653
Sum
[ppm]
3507
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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