Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SGB15N120
MA000600078
PG-TO263-3-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
10.547
0.304
0.091
304.026
2.667
10.201
112.215
557.677
9.657
0.228
0.001
0.169
0.135
6.455
0.165
0.548
547.666
Average
Mass
[%]
0.67
0.02
0.01
19.45
0.17
0.65
7.18
35.70
0.62
0.01
0.00
0.01
0.01
0.41
0.01
0.04
35.04
29. August 2013
1562.75 mg
Sum
[%]
0.67
Average
Mass
[ppm]
6749
195
58
19.48
0.17
194545
1706
6528
71806
43.53
0.62
356855
6179
146
0.01
1
108
87
0.43
4131
105
351
35.09
350450
350906
1000000
4326
146
435190
6179
194798
1706
Sum
[ppm]
6749
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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