Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IFX7805ABTC
MA001089394
PG-TO263-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
lead
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7439-92-1
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
1.237
0.304
0.091
304.026
0.167
1.461
67.189
661.661
9.657
0.228
0.001
1.517
0.040
0.032
0.548
0.165
547.666
Average
Mass
[%]
0.08
0.02
0.01
19.05
0.01
0.09
4.21
41.45
0.61
0.01
0.00
0.10
0.00
0.00
0.03
0.01
34.32
29. August 2013
1595.99 mg
Sum
[%]
0.08
Average
Mass
[ppm]
775
191
57
19.08
0.01
190494
105
915
42098
45.75
0.61
414576
6051
143
0.01
1
951
25
0.10
20
344
103
34.36
343151
343598
1000000
996
143
457590
6051
190742
105
Sum
[ppm]
775
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com