Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD65R660CFDA
MA001016866
PG-TO252-3-313
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
3.294
0.147
0.044
147.096
0.535
1.404
24.575
114.448
3.740
0.003
1.421
0.074
0.059
2.835
0.019
0.006
19.177
Average
Mass
[%]
1.03
0.05
0.01
46.13
0.17
0.44
7.71
35.89
1.17
0.00
0.45
0.02
0.02
0.89
0.01
0.00
6.01
29. August 2013
318.88 mg
Sum
[%]
1.03
Average
Mass
[ppm]
10330
462
139
46.19
0.17
461292
1676
4404
77066
44.04
1.17
358908
11729
11
0.45
4455
233
186
0.93
8891
60
18
6.02
60140
60218
1000000
9310
4466
440378
11729
461893
1676
Sum
[ppm]
10330
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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