Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IKP10N60T
MA000984558
PG-TO220-3-1
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
1.465
0.816
0.245
815.335
2.703
5.962
113.270
476.926
21.462
0.244
0.001
0.137
0.343
0.892
0.590
0.177
589.466
Average
Mass
[%]
0.07
0.04
0.01
40.17
0.13
0.29
5.58
23.49
1.06
0.01
0.00
0.01
0.02
0.04
0.03
0.01
29.04
29. August 2013
2030.03 mg
Sum
[%]
0.07
Average
Mass
[ppm]
722
402
121
40.22
0.13
401635
1331
2937
55797
29.36
1.06
234935
10572
120
0.01
1
68
169
0.07
439
291
87
29.08
290373
290751
1000000
676
120
293669
10572
402159
1331
Sum
[ppm]
722
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com