Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPA032N06N3 G
MA000975318
PG-TO220-3-111
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
6.442
1.120
0.336
1118.332
9.511
2.187
205.539
885.565
7.942
0.305
0.001
0.327
0.818
2.126
Average
Mass
[%]
0.29
0.05
0.02
49.93
0.42
0.10
9.17
39.52
0.35
0.01
0.00
0.01
0.04
0.09
29. August 2013
2240.55 mg
Sum
[%]
0.29
Average
Mass
[ppm]
2875
500
150
50.00
0.42
499133
4245
976
91736
48.79
0.35
395244
3545
136
0.01
0
146
365
0.14
949
1460
1000000
136
487956
3545
499783
4245
Sum
[ppm]
2875
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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